Examination of Glass-Silicon and Glass-Glass Bonding Techniques for Microfluidic Systems
نویسندگان
چکیده
We report here on the results of experiments concerning particular bonding processes potentially useful for ultimate miniaturization of microfluidic systems. Direct anodic bonding of continuous thin Pyrex glass of 250 pm thickness to silicon substrates gives multiple, large voids in the glass. Etchback of thick glass of 1200 pm thickness bonded to silicon substrates gives thin continuous glass layers of 189 pm thickness without voids over areas of 5 cm x 12 cm. Glass was also successfully bonded to glass by thermal bonding at 800 "C over a 5 cm x 7 cm area. Anticipated applications include microfabricated DNA sequencing, flow injection analysis, and liquid and gas chromatography microinstruments.
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